System in package (SiP) technology applications

Author

Koh, Wei

Author_Institution

Kingston Technol. Co., Fountain Valley, CA, USA

fYear

2005

fDate

30 Aug.-2 Sept. 2005

Firstpage

61

Lastpage

66

Abstract

System in package (SiP) and multichip package (MCP) in recent years have seen expanded applications in portable, consumer electronics as well as computing and telecommunications. Memory-related packages now occupy a large share of SiP. This paper uses the NAND and NOR flash memory technology and their SiP packages as example to illuminate the market trend and major applications of SiP. Some examples of SiP and MCP design for flash and SRAM, DRAM memory packages and digital memory cards are described as example. The manufacturing process, testing, cost, reliability concerns and future technology development outlook are discussed.

Keywords

DRAM chips; SRAM chips; flash memories; memory cards; multichip modules; semiconductor device manufacture; semiconductor device reliability; system-in-package; DRAM memory packages; NAND flash memory technology; NOR flash memory technology; SRAM memory packages; consumer electronics; cost; digital memory cards; flash memory packages; manufacturing process; market trend; multichip package; reliability; system in package technology; testing; Assembly; Chip scale packaging; Consumer electronics; Costs; Digital cameras; Electronics packaging; Flash memory; Mobile handsets; Radio frequency; Random access memory;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564753

Filename

1564753