Characterization and processing of low dielectric constant thick film substrates for MCM-C modules

Author

Kellerman, Dave ; Nabatian, David J. ; Bokalo, Peter ; He, Feng ; Retherford, Larry ; Elshabini, Aicha ; Barlow, Fred

fYear

1998

fDate

15-17 Apr 1998

Firstpage

200

Lastpage

205

Abstract

The application of a new microsphere low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5×8.5 in² with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. The electrical, physical, and materials characterization of both silver and gold compatible multilayer low K dielectric material is detailed. High frequency characterization of the material is also discussed over a wide frequency bandwidth between 1-12 GHz

Keywords

ceramics; etching; hybrid integrated circuits; integrated circuit metallisation; microwave integrated circuits; multichip modules; permittivity; thick film circuits; 1 to 12 GHz; 6.5 in; 8.5 in; Ag; Au; MCM-C; MCM-C modules; MCM-C substrates; electrical characterization; etched gold metallization; etched silver metallization; frequency bandwidth; high frequency characterization; large ceramic board processing; low dielectric constant thick film substrates; materials characterization; metal layers; microsphere low K thick film material; multilayer low K dielectric material; physical characterization; screen printed gold metallization; screen printed silver metallization; Ceramics; Dielectric constant; Dielectric materials; Dielectric substrates; Etching; Frequency; Gold; Metallization; Silver; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670780

Filename

670780