• DocumentCode
    2851959
  • Title

    The method for inner surface finishing of bend and shaped pipe

  • Author

    Qu, Ping-Ping ; Liu, Wei-Na

  • Author_Institution
    Changchun Univ. of Sci. & Technol., Changchun, China
  • fYear
    2012
  • fDate
    24-27 June 2012
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    In view of the tough problem about finishing and ultra-precision machining in inner surface of bend and shaped pipe, this paper proposes one new polishing method and technology, and accordingly develops not only the sphere rotating polishing head connected through the flexible wire which is suit for pipe bore surface finishing but also supporting technological equipment and fixtures. Polishing and micro-machining of chamfering in bent and shaped pipe bore surface are able to be achieved successfully the method, respectively. Therefore, other existing methods are incomparable with the advanced method. Inner interface roughness average (Ra) is chosen as criterion to evaluate the polishing method. As a result, original Ra is 10.3867μm, under the condition of velocity of polishing tool does not vary, Ra is 4.2444μm after 2 min polishing, Ra rate decreases 59.14%. After 4 min polishing, Ra is 3.4902μm, Ra rate decreases 66.40%. After 8 min polishing, Ra is 2.8574μm, Ra rate decreases 72.49%. It fully proves that the new polishing method proposed can efficiently address the problem on finishing and ultra-precision machining in inner surface of bent and shaped pipe.
  • Keywords
    fixtures; micromachining; pipes; polishing; polishing machines; bend pipe; chamfering; inner interface roughness average; inner surface finishing; micromachining; polishing method; polishing tool velocity; shaped pipe; technological equipment; technological fixtures; ultraprecision machining; Pumps; inner surface of bend; polishing tool; shaped pipe;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical & Electronics Engineering (EEESYM), 2012 IEEE Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2363-5
  • Type

    conf

  • DOI
    10.1109/EEESym.2012.6258698
  • Filename
    6258698