• DocumentCode
    2852851
  • Title

    Multi-GHz loopback testing using MEMs switches and SiGe logic

  • Author

    Keezer, D.C. ; Minier, D. ; Ducharme, P. ; Viens, D. ; Flynn, G. ; McKillop, J.S.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2007
  • fDate
    21-26 Oct. 2007
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    This paper demonstrates the application of micro-electromechanical switches (MEMs) and SiGe logic devices for passive and active loopback testing of wide data buses at rates up to 6.4Gbps per signal. Target applications include HyperTransport, Fully-Buffered DIMM, and PCIexpress, among others. Recently-commercialized MEMs technology provides high bandwidth (>7GHz) in very small packages in order to support wide parallel buses. SiGe logic also supports >7 Gbps signals when active shaping of the waveform is required. Loopback modules are described with between 9 and 16 differential channels. Multiple cards handle very wide buses or multiple ports. Passive cards utilize MEMs for switching between the Loopback (self-test) mode and traditional ATE source/receiver channels (which are also used for DC parametric tests). It is this switching function that benefits from the MEMs increased density. Active loopback cards provide additional waveform-shaping functions, such as buffering, amplitude attenuation or modulation, deskew, delay adjustment, jitter injection, etc. The modular approach permits pre-calibration of the loopback electronics, and easy reconfiguration between design validation, characterization testing, and high-volume production testing.
  • Keywords
    Ge-Si alloys; integrated logic circuits; microswitches; system buses; test equipment; MEMs switch; MEMs technology; active loopback card; active loopback testing; active waveform shaping; differential channel; logic device; loopback electronics; loopback module; micro-electromechanical switch; passive loopback testing; switching function; Bandwidth; Data buses; Electronic equipment testing; Germanium silicon alloys; Logic devices; Logic testing; Microswitches; Packaging; Silicon germanium; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2007. ITC 2007. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-1127-6
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2007.4437581
  • Filename
    4437581