• DocumentCode
    2854480
  • Title

    How to ensure zero defects from the beginning with semiconductor test methods

  • Author

    Gessner, Bernd

  • Author_Institution
    austriamicrosystems AG, Graz
  • fYear
    2007
  • fDate
    21-26 Oct. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Today, reliability of electronic products is considered as the minimum requirement to ensure the functionality in a safe and reliable way over years. From the semiconductor sector, as the provider from high-integrated circuits, this trend, is one of the main challenges to ensure the reliability of the product, but much more to precisely predict the reliability of those products. austriamicrosystems very early recognized this trend and implemented the zero-defect program over all process steps from design to the end-of-the-life their product. In this paper an overview of the zero-defect program the achievements and the methods are described is shown.
  • Keywords
    electronic products; integrated circuit design; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; quality assurance; austriamicrosystems; electronic product reliability; integrated circuit design; quality assurance; semiconductor test methods; zero-defect program; Area measurement; Electronic equipment testing; Integrated circuit reliability; Manufacturing; Product design; Production; Quality assurance; Semiconductor device reliability; Semiconductor device testing; Space exploration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2007. ITC 2007. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-1127-6
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2007.4437697
  • Filename
    4437697