Flip chip interconnects with electroplated, extended eutectic solder

Author

Glezen, John H. ; Naseem, H.A. ; Fritsch, I. ; Ulrich, R.K. ; Brown, W.D. ; Schaper, L.W.

Author_Institution

Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA

fYear

1998

fDate

15-17 Apr 1998

Firstpage

319

Lastpage

323

Abstract

A study was performed on electroplating of an extended eutectic solder structure. The use of electroplating technology enabled firm control over the size and shape of grains in the deposit. Grain size and shape in turn affected the diffusion of lead and tin through bulk phases as well as along grain boundaries. The control over diffusion affected the reflow properties of the final solder structure. The reflow properties affected the strength of the flip-chip bond, as well as the self-alignment properties of the solder. The structures were then tested for their electrical resistance

Keywords

diffusion; electroplating; eutectic alloys; flip-chip devices; grain boundary diffusion; grain size; integrated circuit interconnections; integrated circuit packaging; lead alloys; microassembling; reflow soldering; tin alloys; SnPb; bulk phase diffusion; electrical resistance; electroplated extended eutectic solder; electroplating; electroplating technology; extended eutectic solder structure; flip chip interconnects; flip-chip bond strength; grain boundary diffusion; grain shape control; grain size control; lead diffusion; reflow properties; solder self-alignment properties; solder structure; tin diffusion; Bonding; Electric resistance; Flip chip; Grain boundaries; Grain size; Lead; Shape control; Size control; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-4850-8

Type

conf

DOI

10.1109/ICMCM.1998.670801

Filename

670801