• DocumentCode
    2862609
  • Title

    Temperature Integrated Load Sharing of Paralleled Modules

  • Author

    Barnette, J.L. ; Zolghadri, M.R. ; Walters, M. ; Homaifar, A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina A&T State Univ., Greensboro, NC
  • fYear
    2006
  • fDate
    24-26 May 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Paralleling power modules is designed to share system loads (stresses) equally to improve system reliability. Due to variations in the parameters in the power converter system, temperature mismatches may occur. These mismatches may lead to unequal life expectancy of individual converters in the total system. It is believed that equalizing the operating temperature of the semiconductor devices may improve total system reliability. In this paper a new thermal-based load-sharing scheme for parallel converters is proposed. In this scheme, the load current is redistributed among parallel converters based on the temperature of the converters. The main goal is to minimize the relative temperature difference between parallel converters while they are supporting load current. To avoid an additional temperature sharing bus, temperature information is integrated with the current information. This information instead of current alone is used in a structure very similar to average current sharing to control the output current of each converter. In this way the converter with the highest temperature will support the least of the load current. Stability analysis of the closed loop system is presented through small signal modelling the parallel converters. Simulation and experimental results presented confirm the performance of the proposed method
  • Keywords
    closed loop systems; electric current control; power convertors; stability; closed loop system stability analysis; load current; output current control; parallel power modules; power converter system; semiconductor devices; temperature integrated load sharing; temperature mismatches; thermal-based load-sharing scheme; Heat sinks; Multichip modules; Power system modeling; Power system reliability; Power system simulation; Temperature; Thermal conductivity; Thermal loading; Thermal stresses; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2006 1ST IEEE Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9513-1
  • Electronic_ISBN
    0-7803-9514-X
  • Type

    conf

  • DOI
    10.1109/ICIEA.2006.257370
  • Filename
    4025971