DocumentCode
2865199
Title
Packaging for high performance computers
Author
Joy, R.
Author_Institution
IBM Corp., Hopwell Junction, NY, USA
Volume
XXI
fYear
1978
fDate
15-17 Feb. 1978
Firstpage
191
Lastpage
191
Abstract
The session will be focused on how packaging technology influences the performance and cost of current and future computers. Alternative packaging designs will be compared, with emphasis on their capabilities, limitations and extendability to future machines.
Keywords
Computer aided instruction; Cooling; Costs; Coupling circuits; High performance computing; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Packaging machines; Propagation delay;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference. Digest of Technical Papers. 1978 IEEE International
Conference_Location
San Francisco, CA, USA
Type
conf
DOI
10.1109/ISSCC.1978.1155807
Filename
1155807
Link To Document