• DocumentCode
    2866108
  • Title

    A scalable embedded DSP core for SoC applications

  • Author

    Panis, C. ; Hirnschrott, U. ; Farfeleder, S. ; Krall, A. ; Laure, G. ; Lazian, W. ; Nurmi, Jari

  • fYear
    2004
  • fDate
    16-18 Nov. 2004
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    Increasing system complexity of SoC (system-on-chip) and SiP (system-in-package) applications leads to the strong demand of platform based solutions. Software programmable embedded cores are required to provide flexibility to these platforms. Compared with dedicated hardware implementations the provided flexibility leads to increased silicon area and power dissipation, which is problematic for high volume products. This paper introduces xDSPcore, a scalable embedded DSP processor which allows to scale major architectural features to application specific requirements. Compatibility issues caused by different core versions are covered by the support of efficient programming in high-level languages like C, which is achieved by an optimizing C-compiler and by a compiler friendly core architecture. A particular core definition is specified by a XML based configuration file.
  • Keywords
    C language; PLD programming; computer architecture; digital signal processing chips; embedded systems; microprogramming; optimising compilers; programmable circuits; system-on-chip; SiP; SoC; SoC applications; XML based configuration file; application specific requirements; architectural features scaling; compiler friendly core architecture; core definition; core version compatibility issues; dedicated hardware implementations; efficient C programming; high volume products; high-level languages; optimizing C-compiler; platform based solutions; power dissipation; scalable embedded DSP core; silicon area; software programmable embedded cores; system complexity; system-in-package; system-on-chip; xDSPcore; Application software; Digital signal processing; Embedded software; Hardware; High level languages; Optimizing compilers; Power dissipation; Program processors; Silicon; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System-on-Chip, 2004. Proceedings. 2004 International Symposium on
  • Print_ISBN
    0-7803-8558-6
  • Type

    conf

  • DOI
    10.1109/ISSOC.2004.1411155
  • Filename
    1411155