• DocumentCode
    2867316
  • Title

    A sensor fusion based methodology for real time furnace diagnostics

  • Author

    Wang, Jiangxin ; Spanos, Costas J.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    397
  • Lastpage
    406
  • Abstract
    Precise control of process temperature has become increasingly important in today´s semiconductor industry. Multi-zone batch furnaces are used widely in current manufacturing lines, and high reliability of furnace systems is a crucial factor in achieving high product yield. However, uncertainty caused by sensor noise and failure may degrade reliability. In this work, we developed a methodology based on thermal modeling and sensor fusion techniques to detect temperature sensor failures, power supply failures, and system faults for the multi-zone furnace systems. The typical types of failures have been defined. The impact of single failures and different combinations of failures on the system behavior has been studied. The furnace system has been modeled based on both physical considerations and experimental data extraction. The fault detection methodology has been tested in simulations. Principal component analysis (PCA) is utilized for choosing data types for different fault detection purposes. Sensor fusion is used to enhance reliability
  • Keywords
    fault diagnosis; furnaces; principal component analysis; semiconductor process modelling; sensor fusion; temperature sensors; fault detection; multi-zone batch furnace; parameter extraction; power supply failure; principal component analysis; real-time diagnostics; semiconductor processing; sensor fusion; simulation model; temperature sensor failure; thermal model; Electronics industry; Fault detection; Furnaces; Power system modeling; Power system reliability; Principal component analysis; Process control; Sensor fusion; Temperature control; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5921-6
  • Type

    conf

  • DOI
    10.1109/ASMC.2000.902618
  • Filename
    902618