• DocumentCode
    2867854
  • Title

    Thermo-Contact Coupling Finite Element Method Analysis of Wheel/Rail under Sliding Status

  • Author

    Sun Chuanxi ; Zhang Jun ; Wang Chunyan ; Zhang Xueshan

  • Author_Institution
    Sch. of Traffic & Transp. Eng., Dalian Jiaotong Univ., Dalian, China
  • fYear
    2009
  • fDate
    19-20 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    When the train is hauling at high speed or processing emergency brake, the high temperature incurred by friction normally will cause fateful damage to the wheel/rail contact surface, invalidate the wheel/rail and endanger traffic safety. The main factor to cause wear, flatting and checking of the wheel/rail is the friction heat caused by the relative sliding between the wheel and the rail. Focused on this problem, in this article, in order to analyze the temperature rise and thermal stress of the wheel/rail during the wheel´s sliding, the author adopted finite element method to perform a thermo-contact coupling calculation on the condition that the wheel is sliding on the rail. The model takes into accounts the impact of wheel´s diameter, relative sliding speed and material attributes on the transient temperature field and stress field. The results demonstrates that the thermal stress caused by the wheel/rail friction is on the same scalar level with the stress caused by the mechanical load, the temperature rise and thermal stress are in direct ratio to the relative sliding speed, thermal expansion coefficient and Young´s modulus, and are in inverse proportion to wheel´s diameter and the specific heat.
  • Keywords
    Young´s modulus; failure analysis; finite element analysis; rails; sliding friction; thermal stresses; wear; wheels; Young´s modulus; finite element method analysis; friction heat; mechanical load; sliding status; temperature rise; thermal stress; thermocontact coupling; traffic safety; train; wear; wheel-rail contact surface; Finite element methods; Friction; Performance analysis; Rails; Railway safety; Temperature; Thermal expansion; Thermal loading; Thermal stresses; Wheels;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Engineering and Computer Science, 2009. ICIECS 2009. International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-4994-1
  • Type

    conf

  • DOI
    10.1109/ICIECS.2009.5366456
  • Filename
    5366456