Dynamic Analysis of Circuit Boards in ANSYS

Author

Xie, Mingjun ; Huang, Dagui ; Zhang, Tianlin ; Lu, Liang

Author_Institution

Sch. of Mechatronic Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu

fYear

2006

fDate

25-28 June 2006

Firstpage

1403

Lastpage

1407

Abstract

Modal analysis and random vibration analysis on a circuit board are presented in this paper based on simplified physical model. We used a commercial finite element program (ANSYS 9.0) for vibration analysis. The calculation result was compared and verified by that from the experiment. This study shows that the predicted frequency data favorably agrees with test data (within 7.5% error range), predicted vibration amplitudes are in a reasonable range at major PCB location when compared with the test data, but do not always agree well at the locations where PCB has more complicated structural features and boundary conditions. We gave the possible reason of the discrepancies between the measured and predicted

Keywords

circuit simulation; finite element analysis; printed circuit design; ANSYS 9.0; PCB; dynamic analysis; finite element program; modal analysis; printed circuit boards; random vibration analysis; Aluminum; Books; Circuit analysis; Circuit testing; Coupling circuits; Lead; Mechatronics; Printed circuits; Soldering; Vibrations; 3-point bending test; ANSYS; circuit board; mode; random vibration;

fLanguage

English

Publisher

ieee

Conference_Titel

Mechatronics and Automation, Proceedings of the 2006 IEEE International Conference on

Conference_Location

Luoyang, Henan

Print_ISBN

1-4244-0465-7

Electronic_ISBN

1-4244-0466-5

Type

conf

DOI

10.1109/ICMA.2006.257834

Filename

4026294