• DocumentCode
    2868796
  • Title

    ELECTROMIGRATION EFFECTS IN VLSI DUE TO VARIOUS CURRENT TYPES

  • Author

    Weis, E. ; Kinsbron, E. ; Snyder, M. ; Vogel, B. ; Croitoru, N.

  • fYear
    1991
  • fDate
    26-30 Oct 1991
  • Firstpage
    354
  • Keywords
    Circuit testing; Conductors; Current density; Electromigration; Fabrication; Life estimation; Lifetime estimation; Stress; Temperature; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1991, Proceedings., International
  • ISSN
    1089-3539
  • Print_ISBN
    0-8186-9156-5
  • Type

    conf

  • DOI
    10.1109/TEST.1991.519694
  • Filename
    519694