DocumentCode
2871427
Title
2005 report on developments in IEC winding wire standards and test methods
Author
Leibowitz, Michael ; Scherrer, Everett J.
Author_Institution
Nat. Electr. Manuf. Assoc., Rosslyn, VA
fYear
2005
fDate
26-26 Oct. 2005
Firstpage
15
Lastpage
19
Abstract
IEC winding wire standards in many ways parallel the information provided in NEMA MW 1000. IEC publications 60317-0-1 through 60317-0-6 provide definitions and general requirements such as dimensions for several standard types of winding wire in a manner similar to NEMA MW 1000 Part 1. IEC publications 60317-1 through 60317-55 provide specifications for particular requirements for various standard winding wires in a manner similar to the standards provided in NEMA MW 1000 Part 2. IEC publications 60851-1 through 60851-5 provide the details of various winding wire test procedures in a manner similar to the information provided in NEMA MW 1000 Part 3. IEC publications 60264-1 through 60264-5 provide winding wire packaging specifications and test procedures for a number of different IEC standard winding wire packages in a manner similar to the information provided in NEMA MW 1000 Appendix B. This paper will discuss the changes that have been made to the aforementioned IEC publications since 2003, and discuss in some detail the similarities and differences between IEC and NEMA MW 1000 requirements and test procedures. The paper will also discuss past efforts and future opportunities for improved harmonization between IEC and NEMA winding wire standards and test procedures
Keywords
IEC standards; cable testing; packaging; windings; IEC 60264-1; IEC 60264-5; IEC 60851-1; IEC 60851-5; IEC winding wire standard; NEMA MW 1000 standard; harmonization; packaging specification; test method; Copper; Glass; IEC standards; Mechanical factors; Packaging; Standards development; Standards publication; Testing; Wire; Wounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference and Electrical Manufacturing Expo, 2005. Proceedings
Conference_Location
Indianapolis, IN
Print_ISBN
0-7803-9145-4
Type
conf
DOI
10.1109/EEIC.2005.1566249
Filename
1566249
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