• DocumentCode
    2872520
  • Title

    HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS

  • Author

    Bassett, Robert W. ; Gillis, Pamela S. ; Shushereba, John J.

  • fYear
    1991
  • fDate
    26-30 Oct 1991
  • Firstpage
    530
  • Keywords
    Assembly; CMOS logic circuits; CMOS memory circuits; CMOS technology; Circuit testing; Electronic packaging thermal management; Electronics packaging; Logic circuits; Pins; System performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1991, Proceedings., International
  • ISSN
    1089-3539
  • Print_ISBN
    0-8186-9156-5
  • Type

    conf

  • DOI
    10.1109/TEST.1991.519715
  • Filename
    519715