Physical Implementation of an Asynchronous 3D-NoC Router Using Serial Vertical Links

Author

Darve, Florian ; Sheibanyrad, Abbas ; Vivet, Pascal ; Pétrot, Frédéric

Author_Institution

LETI, MINATEC, Grenoble, France

fYear

2011

fDate

4-6 July 2011

Firstpage

25

Lastpage

30

Abstract

This paper details the design and implementation of an asynchronous 3D-NoC router using a novel serialization scheme in the vertical directions which targets 3D production oriented processes. A study of the router cost has been conducted for medium and high density TSVs on 65nm and 32nm nodes. A router integrating the serial link has been implemented in 65nm using medium density TSVs. The serial link provides a throughput of 16 Gb/s for an area gain of 57%, and an additional cost of one NoC routing hop in latency and in energy.

Keywords

network routing; network-on-chip; three-dimensional integrated circuits; 3D production oriented processes; asynchronous 3D-NoC router; bit rate 16 Gbit/s; medium density TSV; serial vertical links; size 32 nm; size 65 nm; High definition video; Integrated circuit interconnections; Multiplexing; Synchronization; Three dimensional displays; Through-silicon vias; Throughput; 3D Integration; Asynchronous Circuits; Networks-on-Chip; Serialization;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI (ISVLSI), 2011 IEEE Computer Society Annual Symposium on

Conference_Location

Chennai

ISSN

2159-3469

Print_ISBN

978-1-4577-0803-9

Electronic_ISBN

2159-3469

Type

conf

DOI

10.1109/ISVLSI.2011.59

Filename

5992474