• DocumentCode
    2874278
  • Title

    Effect of H2 dilution in the catalytic CVD processes of SiH4/NH3 system

  • Author

    Morimoto, Takashi ; Ansari, Shafeeque A A G ; Yoneyama, Koji ; Umemoto, Hironobu ; Masuda, Atsushi ; Matsumura, Hideki

  • Author_Institution
    Sch. of Mater. Sci., Japan Adv. Inst. of Sci. & Technol., Ishikawa, Japan
  • fYear
    2004
  • fDate
    26-28 July 2004
  • Firstpage
    97
  • Lastpage
    98
  • Abstract
    Catalytic chemical vapor deposition (Cat-CVD) is one of the most promising techniques for preparing thin SiNx films at low substrate temperatures by using SiH4 and NH3 as material gases (Matsumura et al., 2001 and Osono et al., 2003). One of the problems in this technique has been the low decomposition efficiency of NH3 in the presence of SiH4. The decomposition efficiency decreases sharply by the introduction of a small amount of SiH4 (Umemoto, 2003). Recently, it has been found that the addition of H2 improves not only the decomposition efficiency of NH3 in the presence of SiH4 but also the SiNx film quality (Mahan et al., 2003 and Wang et al., 2004). In the present work, the catalytic decomposition efficiency of NH3 in the SiH4/NH3/H2 system is determined. The absolute H-atom densities were also measured under several conditions.
  • Keywords
    catalysis; chemical vapour deposition; decomposition; hydrogen; nitrogen compounds; semiconductor thin films; silicon compounds; H2; SiH4-NH3; SiNx; catalytic CVD processes; catalytic decomposition efficiency; material gases; thin films; Cleaning; Etching; Hydrogen; Silicides; Silicon compounds; Solids; Toxicology; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, 2004. International Meeting for
  • Print_ISBN
    0-7803-8423-7
  • Electronic_ISBN
    0-7803-8424-5
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2004.1566426
  • Filename
    1566426