Polymer flip-chip bonding of pressure sensors on flexible Kapton film for neonatal catheters

Author

Li, Chunyan ; Sauser, Frank E. ; Azizkhan, Richard ; Ahn, Chong H. ; Papautsky, Ian

Author_Institution

Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA

fYear

2004

fDate

2004

Firstpage

749

Lastpage

752

Abstract

A new polymer flip-chip bonding method on a flexible Kapton film has been developed and applied to dual lumen neonatal catheters integrated with silicon micro pressure sensors. This polymer flip-chip bonding technique requires a low temperature process, which is very desirable for mounting microsensors or microactuators on flexible polymer substrates for medical applications. The silicon micro pressure sensors, which are mounted on a flexible Kapton film with metal lines for neonatal catheter, have been fully characterized in both gas and liquid.

Keywords

bonding processes; catheters; elemental semiconductors; flip-chip devices; microactuators; microsensors; piezoresistive devices; polymer films; pressure sensors; silicon; Si; flexible Kapton film; microactuators; neonatal catheters; piezoresistive devices; polymer flip-chip bonding; polymer substrates; silicon micropressure sensors; Bonding; Catheters; Microactuators; Microsensors; Pediatrics; Polymer films; Semiconductor films; Sensor phenomena and characterization; Silicon; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)

Print_ISBN

0-7803-8265-X

Type

conf

DOI

10.1109/MEMS.2004.1290693

Filename

1290693