• DocumentCode
    2875251
  • Title

    A study of the impact of the growing international dimensions of technology on career development at a National Aerospace Laboratory

  • Author

    Adams, Belinda H.

  • Author_Institution
    NASA Langley Res. Center, Hampton, VA, USA
  • fYear
    1991
  • fDate
    27-31 Oct 1991
  • Firstpage
    121
  • Lastpage
    123
  • Abstract
    It is pointed out that the United States leadership in the aerospace industry is being threatened by mounting global competition. The National Aeronautics and Space Administration´s Langley Research Center must deal with complex issues regarding technology transfer with increasing frequency as foreign governments, venture partners, subcontractors, and suppliers force US firms to involve them in ways that require new and sophisticated technology in exchange for sharing development risk and providing a market for the product. Further career development for NASA Langley engineers being contemplated to maximize the US benefit of technology flow includes increased emphasis on technology assessment during participation in foreign travel and international conferences, enhancement of skills in foreign technology monitoring, and increased support for early career exposure to the broader industry/world view through formal training and domestic international assignments
  • Keywords
    aerospace industry; technology transfer; NASA; NASA Langley engineers; National Aerospace Laboratory; aerospace industry; career development; foreign technology monitoring; foreign travel; international conferences; skills enhancement; technology flow; technology transfer; training; Aerospace industry; Career development; Frequency; Industrial training; Monitoring; NASA; Space technology; Subcontracting; Technology transfer; US Government;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Technology Management : the New International Language
  • Conference_Location
    Portland, OR
  • Print_ISBN
    0-7803-0161-7
  • Type

    conf

  • DOI
    10.1109/PICMET.1991.183592
  • Filename
    183592