DocumentCode
2875710
Title
Limits of air-cooling: status and challenges
Author
Rodgers, Peter ; Eveloy, Valérie ; Pecht, Michael G.
Author_Institution
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
fYear
2005
fDate
15-17 March 2005
Firstpage
116
Lastpage
124
Abstract
Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.
Keywords
cooling; fans; heat sinks; thermal management (packaging); thermal resistance; air cooling; fan performance; heat sink design; heat sink surface fouling; heat spreading; hybrid thermal management; interface thermal resistance minimization; sustainability; Heat sinks; Heat transfer; Phase change materials; Resistance heating; Surface resistance; Thermal conductivity; Thermal loading; Thermal management; Thermal management of electronics; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412167
Filename
1412167
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