57th Electronic Components & Technology Conference

fYear

2007

fDate

May 29 2007-June 1 2007

Abstract

The following topics are dealt with: flip chips; IC interconnections; board level reliability; thermal mechanical loading; radiofrequency components; lead free materials; 3D packaging; copper low k; embedded devices; nanotechnology; advanced substrates; shock vibrations; creep; wafer level packaging; silicon interconnect; solder; microoptical component packaging; radiofrequency modules; polymer composites; MEMS packaging; optical interconnects; system in packaging; package on package; chip scale packaging; bump reliability; electromigration; bioelectronics; flexible electronics.

Keywords

chip scale packaging; electromigration; flexible electronics; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; low-k dielectric thin films; micromechanical devices; nanotechnology; optical interconnections; soldering; solders; system-in-package; wafer level packaging; 3D packaging; MEMS packaging; advanced substrates; bioelectronics; board level reliability; bump reliability; chip scale packaging; copper low k; creep; electromigration; embedded devices; flexible electronics; flip chip; lead free materials; microoptical component packaging; nanotechnology; optical interconnect; package on package; polymer composites; radiofrequency components; radiofrequency modules; shock vibrations; silicon interconnect; solder; system in packaging; thermal mechanical loading; wafer level packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Conference_Location

Reno, NV

ISSN

0569-5503

Print_ISBN

1-4244-0984-5

Type

conf

DOI

10.1109/ECTC.2007.373754

Filename

4249840