Heating capacity analysis of a focused infrared light soldering system

In this work, an optical setup to be used in a focused infrared light soldering system for SMT electronic devices, specifically BGA´s, is proposed and analyzed. The measured output parameters were temperature, optical power per incidence area (irradiance), and optical power spatial distribution. The results of this work show that a peak temperature of 271.1°C at the output of the proposed optical setup was obtained, which meets the temperature required for soldering lead free SMT devices, as well as it can have a highly uniform spatial optical power distribution in the soldering area of a 35mm × 35mm BGA.