Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution

Author

Pei, Min ; Qu, Jianmin

Author_Institution

Georgia Inst. of Technol., Atlanta

fYear

2007

fDate

May 29 2007-June 1 2007

Firstpage

198

Lastpage

204

Abstract

In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of rare earth element (RE) doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that RE doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher RE doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag₃Sn particles.

Keywords

ageing; doping profiles; grain size; integrated circuit packaging; particle size; rare earth metals; silver alloys; solders; thermal analysis; tin alloys; SnAg; aging temperature; aging time; eutectic phase; lead-free solder microstructure evolution; microelectronics packaging; microstructure coarsening rate reduction; multiple length scales; rare earth elements doping effects; Aging; Creep; Doping; Environmentally friendly manufacturing techniques; Lead; Microstructure; Packaging; Steel; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Conference_Location

Reno, NV

ISSN

0569-5503

Print_ISBN

1-4244-0985-3

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2007.373798

Filename

4249884