DocumentCode
2878202
Title
Advanced scanning acoustic technique application in flip-chip devices
Author
Hu, X.H. ; Tay, M.Y. ; Tan, M.C. ; Zhao, X.L. ; Chin, J.M. ; Lei, H.
Author_Institution
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
fYear
2011
fDate
4-7 July 2011
Firstpage
1
Lastpage
4
Abstract
Micron-size embedded defects are challenging to detect using the traditional acoustic scanning microscope. This paper presents the latest acoustic techniques using Virtual Rescanning Mode™ (VRM) from Sonoscan® to successfully capture the defects localized at inter-layer dielectrics (ILD). Defects between copper trace and solder mask are more clearly seen when the magnitude of acoustic waveform changes from time domain to frequency domain.
Keywords
acoustic imaging; copper alloys; flip-chip devices; solders; acoustic waveform; copper trace; flip-chip devices; frequency domain; interlayer dielectrics; micronsize embedded defects; scanning acoustic technique; solder mask; time domain; virtual rescanning mode; Acoustics; Copper; Delamination; Frequency domain analysis; Substrates; Time domain analysis; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location
Incheon
ISSN
1946-1542
Print_ISBN
978-1-4577-0159-7
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2011.5992791
Filename
5992791
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