DocumentCode
2878813
Title
Finite Element Analysis Of The Electromagnetic Radiation From A VLSI Package Heatsink
Author
Ladd, Darcy N. ; Costache, George I.
Author_Institution
University of Ottawa Ottawa, Ontario
fYear
1992
fDate
17-21 Aug. 1992
Firstpage
120
Lastpage
123
Keywords
Electromagnetic analysis; Electromagnetic heating; Electromagnetic radiation; Finite element methods; Magnetic fields; Packaging; Resistance heating; Thermal resistance; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1992. Symposium Record., IEEE 1992 International Symposium on
Conference_Location
Anaheim, CA, USA
Print_ISBN
0-7803-0713-5
Type
conf
DOI
10.1109/ISEMC.1992.626059
Filename
626059
Link To Document