Novel Flip Chip Technologies for Ultra Thin Chip

Telecommunication equipment that supports high-level information networks is being made portable, small and lightweight. Thus, the miniaturization of semiconductor devices is necessary, and chip thinning and flip chip technologies are key in achieving it. The typical flip chip manufacturing steps for thin semiconductor devices are as follows. First, semiconductor elements are formed on a wafer. Surface protective tape is attached to the surface of the wafer and backside grinding is performed to make the wafer thin. Then, dicing tape is attached to the backside of the wafer and the wafer is diced from the surface side, using a diamond blade, and divided into chips. Then, the chips are picked up, using pick up needles and bumps are formed on the surface of the chip. Next, seal resin is attached to a substrate, then the surface of the chip is attached to the substrate with the seal resin and flip chip interconnection and sealing are performed to mount the chip. This manufacturing step has some problems. In this paper, a novel thin package manufacturing process is described.