Highly Efficient Modeling Automation for Electronic Package Thermal Analysis

Thermal simulation and analysis become increasingly vital with rapidly increases of packaging density of IC chips. However, in general, IC design engineers and package engineers do not have the skills of performing such simulation and analysis. One way of overcoming this problem is to develop a tool which can perform thermal analysis on package models automatically. Based on this idea, a customized tool called Package Thermal Automation Simulation Platform is developed with ANSYS^reg Workbench. It is easy for user to input necessary data in a friendly and intuitive wizard interface. After that the whole thermal simulation (including meshing, loading/boundary condition, solving, post process and final report) will be completed automatically and efficiently. This paper introduces the general methodology of the simulation interface and platgorm. This simulation tool has been applied to MLP package family. The results agree well with those from the classic ANSYS and measurement.