Integrated thermal & EM simulation capability in the vorpal software

Summary form only given. The VORPAL software, traditionally used to model plasma and EM problems on large scale supercomputers, has been upgraded to treat thermal conduction as well. This allows us to solve integrated thermal & EM problems, for vacuum electronics, where the heat source is either ohmic wall heating, or charged particle impact. We are presently using this capability in the area of nuclear physics accelerators which are powered by microwaves that travel in waveguides between room-temperature sources and cryogenic accelerator structures. In this problem, the ohmic heat load from the microwaves is strongly affected by the temperature-dependant surface resistance which in turn affects the cryogenic thermal conduction problem. We highlight thermal benchmarking work with a complex HOM feed-through geometry, done in collaboration with researchers at the Thomas Jefferson National Accelerator Laboratory, and discuss upcoming design studies with this emerging tool. This work is also part of an effort to generalize the VORPAL framework to include generalized PDE capabilities, for wider multiphysics capabilities in the accelerator, vacuum electronics, plasma processing and fusion R&D fields. We will also discuss plans for additional multiphysics capabilities, such as non-linear magnetic simulations and plasma sheath models.