• DocumentCode
    2887398
  • Title

    A Transmission-Line Based Technique for De-Embedding Noise Parameters

  • Author

    Yau, Kenneth H K ; Mangan, Alain M. ; Chevalier, P. ; Schvan, P. ; Voinigescu, Sorin P.

  • Author_Institution
    Toronto Univ., Toronto
  • fYear
    2007
  • fDate
    19-22 March 2007
  • Firstpage
    237
  • Lastpage
    242
  • Abstract
    A transmission line-based de-embedding technique for on-wafer S-parameter measurements is extended to the noise parameters of MOSFETs and HBTs. Since it accounts for the distributed effects of interconnect lines and for the pad-interconnect discontinuity, it is expected to yield more accurate results at high frequencies than existing approaches. Furthermore, by requiring only two transmission line test structures to de-embed all test structures in a (Bi)CMOS process, it is one of the most area-efficient. Experimental validation is provided on SiGe HBTs and on 90 nm and 130 nm n-MOSFETs and its accuracy is compared with that of other lumped or distributed de-embedding techniques.
  • Keywords
    MOSFET; S-parameters; heterojunction bipolar transistors; semiconductor device measurement; semiconductor device noise; transmission lines; BiCMOS process; HBT; MOSFET; distributed effects; noise parameters deembedding; on-wafer S-parameter measurement; pad-interconnect discontinuity; size 130 nm; size 90 nm; transmission-line based technique; Frequency; Germanium silicon alloys; MOSFETs; Noise measurement; Scattering parameters; Silicon germanium; Testing; Transmission line discontinuities; Transmission line measurements; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2007. ICMTS '07. IEEE International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    1-4244-0781-8
  • Electronic_ISBN
    1-4244-0781-8
  • Type

    conf

  • DOI
    10.1109/ICMTS.2007.374491
  • Filename
    4252441