• DocumentCode
    2887434
  • Title

    Aperture coupled metamaterial patch antenna with broad E-plane beamwidth for millimeter wave application

  • Author

    Seung-Tae Ko ; Jeong-Hae Lee

  • Author_Institution
    Dept. of Electron. Inf. & Commun. Eng., Hongik Univ., Seoul, South Korea
  • fYear
    2013
  • fDate
    7-13 July 2013
  • Firstpage
    1796
  • Lastpage
    1797
  • Abstract
    In this paper, an aperture coupled metamaterial patch antenna having a broad E-plane half power beamwidth (HPBW) for mm-wave application is presented by using a zeroth-order resonance (ZOR) mode and a half wavelength (TM010) mode. When the ZOR mode and the TM010 mode operate at the same frequency, the E-plane radiation pattern of two modes are combined. Also, by controlling the injected powers to two modes, the E-plane HPBW of the TM010 mode can be broadened. To generate two modes, a patch antenna with an etched hole for TM010 mode and a mushroom antenna inside an etched hole for ZOR mode are designed. In addition, an aperture coupled feeding structure is employed to excite two modes and the position of aperture is optimized to obtain the impedance matching and the broader HPBW. The result shows that the E-plane HPBW of the antenna is broadened to be 135°. Moreover, the antenna has a good radiation efficiency of 91%.
  • Keywords
    antenna feeds; antenna radiation patterns; impedance matching; metamaterial antennas; microstrip antennas; millimetre wave antennas; HPBW; TM mode; ZOR mode; antenna radiation pattern; aperture coupled metamaterial patch antenna; broad e-plane half power beamwidth; efficiency 91 percent; etched hole; feeding structure; impedance matching; millimeter wave application; mm-wave application; mushroom antenna; zeroth-order resonance mode; Antenna radiation patterns; Apertures; Metamaterials; Millimeter wave communication; Patch antennas; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4673-5315-1
  • Type

    conf

  • DOI
    10.1109/APS.2013.6711557
  • Filename
    6711557