Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Author

Kariya, Yoshiharu ; Sat, Kana ; Asari, Shota ; Kanda, Yoshihiko

Author_Institution

Mater. Sci. & Eng. Dept., Shibaura Inst. of Technol., Tokyo, Japan

fYear

2010

fDate

2-5 June 2010

Firstpage

1

Lastpage

4

Abstract

The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.

Keywords

cracks; fatigue; solders; Sn-Ag-Cu solder joint; ball size; crack initiation life; crack propagation; joint size; low cycle fatigue characteristics; low-cycle fatigue properties; micro solder balls; Copper alloys; Crystal microstructure; Educational institutions; Fatigue; Materials science and technology; Semiconductor device packaging; Semiconductor device reliability; Soldering; Testing; Thermal stresses; Fracture; Lead-free solder; Low-cycle fatigue; Microstructure; Miniature testing; Sn-Ag-Cu;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1087-9870

Print_ISBN

978-1-4244-5342-9

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2010.5501298

Filename

5501298