• DocumentCode
    2889465
  • Title

    Performance of two-step thermoelectric-adsorption heat pump for harsh environment electronics cooling

  • Author

    Sinha, Ashish ; Joshi, Yogendra

  • Author_Institution
    George W Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Performance of a two-stage thermoelectric adsorption heat pump for electronics cooling in a thermally harsh environment has been presented. Adsorption heat pumps have few moving parts, which make them suitable for use in harsh environments that are prone to mechanical shock and high temperatures. Use of a thermoelectric device for heat regeneration during the adsorption-desorption process promises to make the system compact enough for electronic enclosures. Two-step adsorption aims to reduce the thermal variations at the hot and cold faces of the thermoelectric device, thus enhancing its performance. Here, adsorption takes place at two different pressures and this requires two evaporators at two different temperatures. This is unlike most `conventional´ adsorption systems where adsorption takes place at a single evaporator pressure. An experimental setup (for two-step adsorption) was fabricated and tested for a heat rejection temperature of 185°C and cooling load of up to 6 W. Experiments were also carried out for a single step (conventional) adsorption cycle for similar conditions. This allowed comparing the performance of two-step `modified´ adsorption cycle vis-à-vis single step `conventional´ adsorption cycle. COPs of 0.2 and 0.3 were observed for conventional and modified cycles respectively.
  • Keywords
    cooling; heat pumps; thermoelectric devices; adsorption cycle; electronic enclosures; harsh environment electronics cooling; heat regeneration; heat rejection temperature; mechanical shock; single evaporator pressure; two-step thermoelectric-adsorption heat pump; Electronics cooling; Heat pumps; Tellurium; Temperature; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal resistance; Thermoelectric devices; Thermoelectricity; Adsorption; Cooling; Electronics; Environment; Harsh; Regenerative; Thermoelectric;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501385
  • Filename
    5501385