Thermal performance of a thermoelectric air-cooling system with heat sinks

Author

Karng, Sarng Woo ; Shin, Jae-Hoon ; Han, Hun Sik ; Kim, Yun Ho ; Kim, Seo Young

Author_Institution

Energy Mech. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea

fYear

2010

fDate

2-5 June 2010

Firstpage

1

Lastpage

7

Abstract

Thermal performance of a louver-fin and a plate-fin in a thermoelectric cooling system with a duct-flow type fan arrangement is analytically evaluated. The thermoelectric cooling system consists of a thermoelectric module and two heat exchanger fins. The analytic results show that the optimized louver fin has lower thermal resistance than plate fin. The COP and heat absorbed rate of the thermoelectric cooling system with optimized louver fins are about 10% and 6% higher than optimized plate fins, respectively.

Keywords

cooling; heat sinks; duct-flow type fan arrangement; heat exchanger fins; heat sinks; louver-fin; plate-fin; thermal performance; thermal resistance; thermoelectric air-cooling system; thermoelectric cooling system; thermoelectric module; Cooling; Heat sinks; Heat transfer; Resistance heating; Surface resistance; Temperature dependence; Thermal conductivity; Thermal factors; Thermal resistance; Thermoelectricity; Coefficient of performance (COP); Louver fin; Plate fin; Thermal resistance; Thermoelectric module (TEM);

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1087-9870

Print_ISBN

978-1-4244-5342-9

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2010.5501392

Filename

5501392