DocumentCode
2889605
Title
Enhancement of natural convection using synthetic jets
Author
Li, Ri ; Gerstler, William D. ; Arik, Mehmet ; Vanderploeg, Benjamin
Author_Institution
Thermal Syst. Lab., GE Global Res., Niskayuna, NY, USA
fYear
2010
fDate
2-5 June 2010
Firstpage
1
Lastpage
8
Abstract
Natural convection air-cooling is the method of choice for many low power electronics applications due to cost, availability, and reliability. However, its performance is very limited due to buoyancy dependent flow. Therefore, there is a need for further enhancement of natural convection. Enhanced natural convection will allow higher heat dissipation and still largely maintains the simplicity of passive cooling. This paper presents an experimental study on synthetic jet assisted heat transfer on a vertical hot finned plate. Synthetic jets generate pulsed airflow concurrent with buoyancy driven flow. Tests were conducted with a single jet to investigate the effect of jet placement on heat transfer enhancement, while multiple jets were tested to understand how thermal performance changes with the number of jets. As jet placement and the number of jets were varied, local temperature on the plate surface was measured. Comparing natural convection results with and without synthetic jet enhancement, local and average enhancements of heat transfer were quantified. It was found that the cooling enhancement increases with the number of jets, and is sensitive to jet placement. The results show that 3 times enhancement can be achieved with coefficient of performance of 47.
Keywords
jets; natural convection; plates (structures); air-cooling; buoyancy driven flow; cooling enhancement; heat transfer enhancement; low power electronics applications; natural convection; pulsed airflow; synthetic jets; Availability; Costs; Electronics cooling; Heat transfer; Low power electronics; Maintenance; Pulse generation; Temperature sensors; Testing; Thermal conductivity; air cooling; heat transfer enhancement; natural convection; synthetic jet;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1087-9870
Print_ISBN
978-1-4244-5342-9
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2010.5501393
Filename
5501393
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