DocumentCode
2890009
Title
Prediction of Heme Binding Sites in Heme Proteins Using an Integrative Sequence Profile Coupling Evolutionary Information with Physicochemical Properties
Author
Xiong, Yi ; Zhang, Wen ; Zeng, Tao ; Liu, Juan
Author_Institution
Sch. of Comput., Wuhan Univ., Wuhan, China
fYear
2011
fDate
12-15 Nov. 2011
Firstpage
143
Lastpage
146
Abstract
Heme-protein interactions are essential for various biological processes such as electron transfer, catalysis, signal transduction and the control of gene expression. The knowledge of heme binding residues can provide crucial clues to understand the mechanism of heme- protein interactions and aid in functional annotation. In the present work, we propose a sequence-based approach for the accurate prediction of heme binding residues by a novel integrative sequence profile coupling position specific scoring matrices with heme specific physicochemical properties. Particularly, we design an intuitive feature selection scheme for informative physicochemical properties. As shown in the primary results, our integrative sequence profile approach for prediction of heme binding residues outperforms the conventional methods using amino acid and evolutionary information on the 5-fold cross validation and the independent test.
Keywords
biology computing; organic compounds; proteins; 5-fold cross validation; Heme binding sites prediction; Heme-protein interactions; amino acid; biological process; functional annotation; independent test; informative physicochemical properties; integrative sequence profile coupling evolutionary information; integrative sequence profile coupling position specific scoring matrices; intuitive feature selection scheme; sequence-based approach; Amino acids; Bioinformatics; Correlation; Databases; Proteins; Training; Vectors; Amino acid index; Heme binding residue; Integrative sequence profile; Position specific scoring matrix; Support vector machine;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedicine (BIBM), 2011 IEEE International Conference on
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4577-1799-4
Type
conf
DOI
10.1109/BIBM.2011.8
Filename
6120425
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