• DocumentCode
    2896872
  • Title

    ES3: Future system and memory architectures: Transformations by technology and applications

  • Author

    Lu, Ning ; Chang, Ly-Yu ; Takashima, D.

  • Author_Institution
    Etron Technol., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    20-24 Feb. 2011
  • Firstpage
    530
  • Lastpage
    530
  • Abstract
    The emergence of new enabling technologies and applications paradigms will likely drive radical changes in the memory architecture of future systems. With multi-core CPU dies sporting embedded DRAM caches, ever-improving NAND flash storage densities for SSD and SCM, and 3D-integration technologies to bring everything together into a single package, possibilities abound for system enhancements throughout the memory hierarchy. At the same time, applications needs are rapidly evolving as the world shifts from a product-centric economy to a service- and experience-oriented economy focused on hardware such as smartphones, set-top boxes, and 3D digital TV. This evening session will discuss future system and memory architectures from perspectives spanning the 3 C´s: computing, consumer electronics, and communications - considering both what new technology might offer and what new applications might need.
  • Keywords
    DRAM chips; NAND circuits; flash memories; integrated memory circuits; multiprocessing systems; 3D digital TV; 3D-integration technologies; DRAM caches; ES3; NAND flash storage; SCM; SSD; consumer electronics; experience-oriented economy; memory architectures; multi-core CPU dies; service-oriented economy; set-top boxes; smartphones; system architectures; Memory architecture; Smart phones; Streaming media; System analysis and design; TV; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-61284-303-2
  • Type

    conf

  • DOI
    10.1109/ISSCC.2011.5746424
  • Filename
    5746424