Package autoclave delamination study by substrate design improvement

Author

Liu, Jinmei ; Luo, Junhua ; Yao, Jinzhong

Author_Institution

Xiqing Economic Dev. Area, Freescale Semicond. (China) Ltd., Tianjin, China

fYear

2010

fDate

Nov. 30 2010-Dec. 2 2010

Firstpage

1

Lastpage

4

Abstract

When developing new MAPBGA package, package delamination was found after 96hrs autoclave test (121C, 100%RH, 15psig) through CSAM check and cross section analysis. MSL 3, 260C preconditioning was performed before the autoclave test. The improvement study was made on substrate power/ground gold ring design, substrate copper metal roughness and substrate metal layer design. Finally, the package delamination was completely removed by optimizing substrate design.

Keywords

ball grid arrays; copper; delamination; substrates; CSAM check; Cu; MAPBGA package; cross section analysis; package autoclave delamination study; package delamination; substrate copper metal roughness; substrate design improvement; substrate metal layer design; substrate power-ground gold ring design; time 96 hour; Compounds; Copper; Electromagnetic compatibility; Facsimile; Gold; Heating; Substrates; Inner Metal Layer Design; Package Delamination; Substrate Design;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International

Conference_Location

Melaka

ISSN

1089-8190

Print_ISBN

978-1-4244-8825-4

Type

conf

DOI

10.1109/IEMT.2010.5746727

Filename

5746727