• DocumentCode
    2899188
  • Title

    Keep on shrinking interconnect size: Is it still the best solution?

  • Author

    Deschacht, D. ; de Rivaz, S. ; Farcy, A. ; Lacrevaz, T. ; Flechet, B.

  • Author_Institution
    LIRMM, Univ. Montpellier 2, Montpellier, France
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    According to the evolution between each new technological generation of CMOS ICs, ITRS suggests a reduction in interconnect sizes by a factor of around square root of 2. In this paper a reference design rule is based on a perfectly controlled technology of the CMOS 45 nm node, with interconnects width equal to their separation space. Our works are focused on the impact on signal transmission speed and delay along interconnects of decreasing the space or width. To avoid new industrial manufacturing constraints on cost and reliability, this study is performed without modifying process and materials used in the BEOL of CMOS 45 nm IC. We will study interconnects of 50 nm width, with a 50 nm space between lines in accordance with CMOS 32 nm FEOL requirements. In the second time we will relax geometrical constraints to enlarge the scope of application.
  • Keywords
    CMOS integrated circuits; delays; BEOL; CMOS IC; FEOL; ITRS; back end of line; interconnect sizes; reference design rule; signal transmission delay; signal transmission speed; size 32 nm; size 45 nm; size 50 nm; Copper; Delay; Materials; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746734
  • Filename
    5746734