Finite element analysis of a SWEAT structure with a 3-D, nonlinear, coupled thermal-electric model

Author

Dion, Michael J.

Author_Institution

Sematech, Austin, TX, USA

fYear

1992

fDate

16-19 Mar 1992

Firstpage

12

Lastpage

17

Abstract

The standard wafer electromigration accelerated test (SWEAT) structure for metal integrity or highly accelerated electromigration (EM) testing has complexities that make determination of thermal characteristics difficult. Steady-state SWEAT structure thermal-electric characteristics as might exist for the first several seconds of a test, i.e., without changes due to EM, are discussed. A 3-D, nonlinear, coupled thermal-electric finite element model was developed and solved with the ANSYS software tool to investigate heat flow in several regions of the structure. The finite element model is presented. Correlation with nonlinear thermal material parameters is demonstrated, and the importance of modeling lateral heat flow in underlying oxides is shown. Extraction of thermal parameters for use in the EXTRA thermal model is discussed

Keywords

electromigration; electronic engineering computing; finite element analysis; life testing; metallisation; semiconductor process modelling; ANSYS software too; EXTRA thermal model; SWEAT structure; coupled thermal-electric model; finite element model; heat flow; lateral heat flow; metal integrity; nonlinear thermal material parameters; standard wafer electromigration accelerated test; Coupled mode analysis; Couplings; Current density; Finite element methods; Heat sinks; Heating; Life estimation; Materials testing; Stress; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 1992. ICMTS 1992. Proceedings of the 1992 International Conference on

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0535-3

Type

conf

DOI

10.1109/ICMTS.1992.185926

Filename

185926