Past, present and future of electronic packaging

As the first interconnection element after the semiconductor chip itself, IC packaging technologies are the primary gate keepers of electronic system performance. There are a myriad of different types of packages available, each normally targeted for a specific range of semiconductor devices. With so many options, understanding the basics of IC packaging - how they are constructed, what drives cost and what limits performance - is critical to the successful product design. Some of the most common IC packages, from chip scale to BGA packages as well as some of the many 3D stacked and folded structures, will be reviewed and discussed. The instructor will also review wafer level packaging. Finally, a look at the future of IC packaging will be provided to stimulate thought on how to actively engage and direct the future of IC packaging in mindful ways.