Modelling of MST packages

The thermomechanical design of microsystems at both the component and system level requires detailed knowledge of the fabrication of the component, its packaging, and the environment in which it will be placed. The standard approach to the analysis of thermomechanical behaviour of structures is to use finite element tools such as ANSYS or ABAQUS. New MST design software is now coming on the market which tries to address some of the problems with conventional finite element methods. Companies like IntelliSense or Microcosm are offering customised design tools going from the etch and process simulators to the component level thermal, mechanical, or thermal analysis software