Multipacting simulations of TTF-III power coupler components

The TTF-III power coupler adopted for the ILC baseline cavity design has shown a tendency to have long initial high power processing time. A possible cause for the long processing time is believed to be multipacting in various regions of the coupler. To understand performance limitations during high power processing, SLAC has built a flexible high-power coupler test stand. The plan is to test individual sections of the coupler, which includes the cold and warm coaxes, the cold and warm bellows, and the cold window, using the test stand to identify problematic regions. To provide insights for the high power test, detailed numerical simulations of multipacting for these sections will be performed using the 3D multipacting code Track3P.