Packaged antenna solution for the Radio front end @ 60 GHz based on a dielectric resonator

Author

Guzman, J.P. ; Ney, M. ; Perso, C.

Author_Institution

Lab.-STICC, Telecom Bretagne, Brest, France

fYear

2012

fDate

25-28 June 2012

Firstpage

1

Lastpage

4

Abstract

A novel, broadband (15 GHz) and high gain (6 dBi) antenna incorporated in package for the 60 GHz band is presented. This solution avoids separated process for antenna and the package. By the use of laser micromachining possibilities, the antenna-package element has been fabricated with alumina. The antenna is based on a dielectric resonator (DR) that is excited by a coplanar-line fed slot. A size of 36mm² (6×6mm²) is achieved for the package including the antenna and the transmitter power amplifier chip. Interconnection chip-antenna is taken into consideration by use of solder balls from the flip-chip process.

Keywords

alumina; antenna feeds; broadband antennas; coplanar transmission lines; dielectric resonators; flip-chip devices; laser beam machining; micromachining; millimetre wave antennas; power amplifiers; alumina; antenna-package element; broadband antenna; coplanar-line fed slot; dielectric resonator; flip-chip process; frequency 15 GHz; frequency 60 GHz; high-gain antenna; interconnection chip-antenna; laser micromachining; packaged antenna solution; radio front end; solder balls; transmitter power amplifier chip; Antenna measurements; Coplanar waveguides; Dielectric resonator antennas; Dielectrics; Gain; Silicon; 60 GHz; Dielectric Resonator; Si integration; antenna; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Antenna Technology and Applied Electromagnetics (ANTEM), 2012 15th International Symposium on

Conference_Location

Toulouse

Print_ISBN

978-1-4673-0290-6

Type

conf

DOI

10.1109/ANTEM.2012.6262374

Filename

6262374