The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging

Author

Yang, Mingshan ; He, Jie ; Li, Linkai ; Xu, Wenyu

Author_Institution

Beijing Inst. of Petrochem. Technol., Beijing

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

4

Abstract

MEP (mono-functional epoxy group prepolymer) was prepared through reacting biphenol with epichlorohydrin, and the structure were determined by FTIR, XRD and polarizing microscope. Epoxy molding composite(EMC) used for the packaging of ultra-large-scale integrated circuit (IC) was prepared by mixing the liquid crystalline epoxy resin with ortho-cresol novolac epoxy (ECN) using high-speed pre- mixing and twin roller mixing and the better formulation and process parameters had been obtained in this paper. The results have shown that the EMC has the ordered domain of liquid crystalline structure.

Keywords

Fourier transform spectroscopy; X-ray diffraction; infrared spectroscopy; integrated circuit packaging; polymers; FTIR; XRD; biphenol; epichlorohydrin; epoxy molding composite; integrated circuits packaging; large-scale packaging; liquid crystalline epoxy resin; mono-functional epoxy group prepolymer; ortho-cresol novolac epoxy; polarizing microscope; Crystallization; Electromagnetic compatibility; Epoxy resins; High speed integrated circuits; Integrated circuit packaging; Integrated circuit synthesis; Large scale integration; Microscopy; Polarization; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441431

Filename

4441431