• DocumentCode
    2904014
  • Title

    Interconnect Open Defect Diagnosis with Physical Information

  • Author

    Zou, Wei ; Cheng, Wu-Tung ; Reddy, Sudhakar M.

  • Author_Institution
    Mentor Graphics Corp., Wilsonville, OR
  • fYear
    2006
  • fDate
    20-23 Nov. 2006
  • Firstpage
    203
  • Lastpage
    209
  • Abstract
    Circuit behavior in the presence of interconnect open defects is affected by four major factors: the capacitances between the floating node and its neighboring nodes, the capacitances inside down-stream gates, initial trapped charge, and the threshold voltages of down-stream gates. Current interconnect open diagnosis methods either ignore all of these factors or consider a subset of them only. Thus the diagnosis results from current procedures may not be as accurate as possible. In this paper, we present an interconnect open defect diagnosis method taking all these factors into account. Experiments conducted on benchmark circuits demonstrate that the proposed method can achieve a very high diagnosis accuracy and resolution
  • Keywords
    fault diagnosis; integrated circuit interconnections; integrated circuit testing; benchmark circuits; down-stream gate capacitance; down-stream gates; floating node capacitance; initial trapped charge; interconnect open defect diagnosis; neighboring node capacitance; physical information; threshold voltages; CMOS technology; Capacitance; Circuit faults; Cities and towns; Failure analysis; Graphics; Integrated circuit interconnections; Logic; Threshold voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium, 2006. ATS '06. 15th Asian
  • Conference_Location
    Fukuoka
  • ISSN
    1081-7735
  • Print_ISBN
    0-7695-2628-4
  • Type

    conf

  • DOI
    10.1109/ATS.2006.261021
  • Filename
    4030769