DocumentCode
2904014
Title
Interconnect Open Defect Diagnosis with Physical Information
Author
Zou, Wei ; Cheng, Wu-Tung ; Reddy, Sudhakar M.
Author_Institution
Mentor Graphics Corp., Wilsonville, OR
fYear
2006
fDate
20-23 Nov. 2006
Firstpage
203
Lastpage
209
Abstract
Circuit behavior in the presence of interconnect open defects is affected by four major factors: the capacitances between the floating node and its neighboring nodes, the capacitances inside down-stream gates, initial trapped charge, and the threshold voltages of down-stream gates. Current interconnect open diagnosis methods either ignore all of these factors or consider a subset of them only. Thus the diagnosis results from current procedures may not be as accurate as possible. In this paper, we present an interconnect open defect diagnosis method taking all these factors into account. Experiments conducted on benchmark circuits demonstrate that the proposed method can achieve a very high diagnosis accuracy and resolution
Keywords
fault diagnosis; integrated circuit interconnections; integrated circuit testing; benchmark circuits; down-stream gate capacitance; down-stream gates; floating node capacitance; initial trapped charge; interconnect open defect diagnosis; neighboring node capacitance; physical information; threshold voltages; CMOS technology; Capacitance; Circuit faults; Cities and towns; Failure analysis; Graphics; Integrated circuit interconnections; Logic; Threshold voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 2006. ATS '06. 15th Asian
Conference_Location
Fukuoka
ISSN
1081-7735
Print_ISBN
0-7695-2628-4
Type
conf
DOI
10.1109/ATS.2006.261021
Filename
4030769
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