DocumentCode
2905381
Title
Bending and Reliability Test of Chip-on-flex (COF) Assembly Using Anisotropic Conductive Films (ACFs)
Author
Yip, Ming-Chuen ; Huang, Chien-Yuan ; Chen, Chien-Liang ; Lu, Su-Tsai
Author_Institution
Nat. Tsing Hua Univ., Hsinchu
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
3
Abstract
The experiments were divided into two parts. In the first part, the accelerated environmental tests including high humidity (85% RH) at high temperature (85 C) and thermal cycling test (-40 C-125 C). After different storage time of accelerated environmental tests, the COF assemblies were took out and tested at room temperature. The static bendingflexibility was evaluated by the method of four-point bending test with crosshead speed at 0.5 mm/min.
Keywords
environmental testing; integrated circuit reliability; integrated circuit testing; system-on-chip; accelerated environmental tests; anisotropic conductive films; bending test; chip on flex assembly; reliability test; static bendingflexibility; storage time; temperature -40 degC to 125 degC; thermal cycling test; Anisotropic conductive films; Assembly; Fatigue; Frequency; Humidity; Life estimation; Life testing; Packaging; Surface cracks; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441526
Filename
4441526
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