DocumentCode
2905570
Title
Multilayered piezoelectric composite transducers
Author
Leary, R. L O ; Parr, A.C.S. ; Hayward, G.
Author_Institution
Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
Volume
2
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
1306
Abstract
Multilayered piezoelectric materials present themselves as a suitable technology for the development of sub 100kHz transducers. A variety of different configurations have been proposed, including stacked 2-2, 1-3 and 3-1 connectivity configurations. Historically multilayer devices designed for low frequency of operation have comprised uniform layer thickness through the height of the device. The potential for extended bandwidth through the use of non-uniform layers through the thickness dimension has been investigated. In addition commercially available stacked ceramic mechanical actuators have been investigated. A combination of theoretical and experimental assessment has been employed to evaluate each transducer technology. Selection of the passive phase for these multilayer devices is critical. Typically, these devices operate in the high power regime and as such selection of the passive polymer material is crucial - thermal stability coupled with thermal conductivity would be a virtue. To this end a number of polymer materials possessing the appropriate thermal properties have been investigated.
Keywords
composite materials; multilayers; piezoelectric materials; piezoelectric transducers; polymers; connectivity configurations; high power regime; low frequency operation; multilayer devices; nonuniform layers; passive phase; passive polymer material; piezoelectric composite transducers; stacked ceramic mechanical actuators; thermal conductivity; thermal properties; thermal stability; thickness dimension; uniform layer thickness; Actuators; Bandwidth; Ceramics; Conducting materials; Frequency; Nonhomogeneous media; Piezoelectric materials; Piezoelectric transducers; Polymers; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293142
Filename
1293142
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