Packaging and Microelectromechanical Systems (MEMS)

Packaging is critical to the advancement of microsystems integrating microelectromechanical systems (MEMS) with microelectronic, optoelectronic and microwave devices. This paper discusses microsystems packaging with three cases: a) packaging of MEMS: flip-chip assembly to interconnect MEMS devices with other components; b) packaging for MEMS: novel MEMS devices fabricated using packaging technologies such as flexible circuit; and c) MEMS for packaging: MEMS devices used for active alignment for optoelectronic packaging. With such a close relationship between packaging and MEMS, we expect to see many novel microsystems with packaging and MEMS technologies fully integrated in the future.