• DocumentCode
    2906250
  • Title

    Two orders of magnitude leakage power reduction of low voltage SRAMs by row-by-row dynamic Vdd control (RRDV) scheme

  • Author

    Kanda, Kouichi ; Miyazaki, Takayuki ; Sik, Min Kyeong ; Kawaguchi, Hiroshi ; Sakurai, Takayasu

  • Author_Institution
    Inst. of Ind. Sci., Univ. of Tokyo, Japan
  • fYear
    2002
  • fDate
    25-28 Sept. 2002
  • Firstpage
    381
  • Lastpage
    385
  • Abstract
    A novel SRAM scheme is proposed that can reduce the active leakage power by two orders of magnitude. In the low voltage region of less than 1 V, the VTH, VTH, is lowered to less than 0.2 V and the leakage power of memory cells becomes a dominant issue. By dynamically dropping the supply voltage of un-accessed cells row by row, the cell leakage can be reduced exponentially through the drain induced barrier lowering (DIBL) effect. Additionally, to lower the leakage from bit-line through transfer gates of memory cells, un-accessed word lines are applied with a negative voltage together with a reduced swing write technique. The basic advantage is verified by measurement and the effectiveness in future generations is discussed by simulations.
  • Keywords
    SRAM chips; circuit simulation; integrated circuit design; integrated circuit modelling; leakage currents; logic design; logic simulation; low-power electronics; 0.2 V; 1 V; DIBL effect; bit-line/transfer gate leakage; drain induced barrier lowering effect; leakage power reduction; low voltage SRAM; low voltage operating regions; memory cell active leakage power; negative voltage applied un-accessed word lines; reduced swing write techniques; row-by-row dynamic control schemes; un-accessed cell supply voltage dropping; Delay; Fabrics; Industrial control; Leakage current; Low voltage; Maintenance; Random access memory; Threshold voltage; Virtual manufacturing; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC/SOC Conference, 2002. 15th Annual IEEE International
  • Print_ISBN
    0-7803-7494-0
  • Type

    conf

  • DOI
    10.1109/ASIC.2002.1158089
  • Filename
    1158089