High-bandwidth data transmission of new transceiver module through optical interconnection

Author

Ito, Yuka ; Terada, Shinsuke ; Arai, Shinya ; Choki, Koji ; Fukushima, Takafumi ; Koyangi, Mitsumasa

Author_Institution

Circuitry with Opt. Interconnection Bus. Dev. Dept., Sumitomo Bakelite Co., Ltd., Utsunomiya, Japan

fYear

2012

fDate

Jan. 31 2012-Feb. 2 2012

Firstpage

1

Lastpage

4

Abstract

This paper presents optical interconnection for module-to-module length for high-performance computing system. A new multi-chip transceiver module consisting of optical components, IC chips, flexible printed circuits (FPCs), and a sheet of optical polynorbornene (PNB) waveguides was fabricated by simple packaging processes. Waveguide sheet with micromirrors and the FPCs mounting of O/E devices were completed independently. After that, the waveguide sheet was aligned to optical devices on FPCs passively. Optical loss for waveguide including propagation and micromirror couplings was 3.30 dB. We successfully demonstrate high-bandwidth 100-Gbps (12.5 Gbps/ch × 8 channels) data transmission with the module, on which two 4-channel vertical-cavity surface emitting laser (VCSEL) arrays, one VCSEL driver (VD), two 4-channel PD arrays, and one transimpedance amplifier/limiting amplifier (TIA/LA) were mounted.

Keywords

data communication; micromirrors; operational amplifiers; optical couplers; optical interconnections; optical losses; optical transceivers; optical waveguides; printed circuits; surface emitting lasers; 4-channel vertical-cavity surface emitting laser; O/E devices; VCSEL arrays; VCSEL driver; bit rate 100 Gbit/s; flexible printed circuits; high-bandwidth data transmission; high-performance computing system; integrated circuit chips; micromirror couplings; module-to-module length; multichip transceiver module; optical components; optical interconnection; optical loss; optical polynorbornene waveguides; simple packaging; transimpedance amplifier/limiting amplifier; two 4-channel PD arrays; waveguide sheet; Loss measurement; Optical device fabrication; Optical films; Optical interconnections; Optical losses; Optical waveguides; Propagation losses;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2011 IEEE International

Conference_Location

Osaka

Print_ISBN

978-1-4673-2189-1

Type

conf

DOI

10.1109/3DIC.2012.6263010

Filename

6263010